Strain Field Measurement Using Image Processing, Applications in Damage and Fracture Testing

Y. Yang (1998). "Strain Field Measurement Using Image Processing, Applications in Damage and Fracture Testing." In Proceedings of FraMCoS 3, Gifu, Japan.

Y. Yang. "Strain Field Measurement Using Image Processing, Applications in Damage and Fracture Testing." Paper presented at FraMCoS 3, Gifu, Japan, 1998.

Y. Yang, "Strain Field Measurement Using Image Processing, Applications in Damage and Fracture Testing," in Proc. FraMCoS 3, Gifu, Japan, 1998.

@inproceedings{y-yang1998,
  title     = {Strain Field Measurement Using Image Processing, Applications in Damage and Fracture Testing},
  author    = {Y. Yang},
  year      = {1998},
  booktitle = {Proceedings of FraMCoS 3},
  address   = {Gifu, Japan},
}

TY  - CPAPER
TI  - Strain Field Measurement Using Image Processing, Applications in Damage and Fracture Testing
AU  - Y. Yang
PY  - 1998
T2  - Proceedings of FraMCoS 3
CY  - Gifu, Japan
UR  - http://framcos.org/wp-content/uploads/framcos-papers/Strain_Field_Measurement_Using_Image_Processing%2C_Applications_in_Damage_and_Frac.pdf
ER  -