Practical Model of Crack and Bond Slip for Thermal Crack Analysis

H. Morimoto, W. Koyanagi (1998). "Practical Model of Crack and Bond Slip for Thermal Crack Analysis." In Proceedings of FraMCoS 3, Gifu, Japan.

H. Morimoto, W. Koyanagi. "Practical Model of Crack and Bond Slip for Thermal Crack Analysis." Paper presented at FraMCoS 3, Gifu, Japan, 1998.

H. Morimoto, W. Koyanagi, "Practical Model of Crack and Bond Slip for Thermal Crack Analysis," in Proc. FraMCoS 3, Gifu, Japan, 1998.

@inproceedings{h-morimoto1998,
  title     = {Practical Model of Crack and Bond Slip for Thermal Crack Analysis},
  author    = {H. Morimoto, W. Koyanagi},
  year      = {1998},
  booktitle = {Proceedings of FraMCoS 3},
  address   = {Gifu, Japan},
}

TY  - CPAPER
TI  - Practical Model of Crack and Bond Slip for Thermal Crack Analysis
AU  - H. Morimoto
AU  - W. Koyanagi
PY  - 1998
T2  - Proceedings of FraMCoS 3
CY  - Gifu, Japan
UR  - https://framcos.org/wp-content/uploads/framcos-papers/Practical_Model_of_Crack_and_Bond_Slip_for_Thermal_Crack_Analysis.pdf
AB  - This paper deals with a practical 3-D analysis model for thermal stress and crack width. The model applied in this study is based on the concept of discrete crack approach. The authors analyzed the thermal stress and crack width in a wall structure by FEM incorporating the 3-D analysis model, and elucidated the 3-D distribution of thermal stress and crack width in the wall in comparison with the actual measurements. The effect of reinforcement on crack control was also investigated.
ER  -